Signal SK Hynix and Sandisk Unveil First High Bandwidth Flash (HBF) Standard at FMS 2026

Summary

SK hynix, together with Sandisk, unveiled the first High Bandwidth Flash (HBF) standard specifications at FMS 2026, the world's largest memory technology conference, held August 4, 2026 in Santa Clara, California, according to SK hynix's newsroom. The open standard, released through the Open Compute Project, supports up to 512GB capacity and 3TB/s bandwidth with UCIe support, aimed at easing AI memory bottlenecks. SK hynix began collaborating with Sandisk in August 2025 and launched the HBF Consortium in February 2026 with participants including Google and Tenstorrent, unveiling the finalized standard six months later. Simultaneously, SK hynix unveiled for the first time a wafer and product for its 10th-generation (V10) 375-layer 4D NAND, delivering 2.5 times the performance per watt of the previous generation and optimized for data center environments, with mass production of related enterprise SSDs planned for early next year. Full commercialization of HBF technology is expected around 2030. By establishing standards early, SK hynix aims to secure market leadership and build cooperative relationships with major technology customers and materials, parts, and equipment suppliers ahead of the technology's broader rollout.